Sander Dorrestein
Sander is a mechanical engineer with a particular interest in micro-assembly processes and technologies. He has extensive experience in bonding and joining applications for both micro-electrical and micro-optical packaging. His proven track record includes bonding and joining processes currently used in manufacturing for consumer, medical, industrial, and automotive applications.
Publications
Co-packaged electronics with microfluidics for direct-to-package cooling
Communications Engineering – open access journal from Nature portfolio
Advancing the semiconductorisation of photonic chip packaging
PIC Magazine, issue 4, p. 32-39
A 2-Tier TRL Calibration Technique to Assess Flip-Chip Interconnects at D-Band
103rd ARFTG Microwave Measurement Conference (ARFTG), Washington, DC, USA, 2024
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
IEEE 73rd Electronic Components and Technology Conference (ECTC)