Certificates for Semiconductor Packaging minor students

Published on 25 January 2025

CITC celebrates the International Day of Education together with the students who finished their Semiconductor Packaging minor this week.

Three proud students holding their certificate of completion of their Semiconductor Packaging minor
The students' hard work on the CITC, NXP Semiconductors and ASMPT ALSI assignments has paid off.

Minor student becomes intern

One of the students, Alex Harper (in the photo on the left), soon returned to CITC as an intern. In the coming months, he will be working on slit nozzle dispensing. His assignment focuses on the design of the nozzle and process research.

Alternative slit nozzle

For those who like to have a little background on this topic: current slit nozzles that are commercially available are relatively expensive and have a long lead time of 2-3 months. CITC worked on an alternative design (patent pending) which differs from other nozzles in that the design is flexible.

Iterations in both dispense volume and shapes are easy to make. Production is done with 3D printing, which is cheap and makes the nozzles disposable. Alex will work on improvements to the current design and define process parameters – one cannot exist without the other.

More information about internships at CITC