Chip packaging for the next generation
What a great day team CITC/TNO had last Saturday! We were once again present at the Nijmegen Technology Day and part of the semiconductor cluster - together with NXP Semiconductors, the Technasium team of Mondial College and Lifeport Semiconductor Industries.
We brought along a whole range of chip packages, leadframes, and demo units to show our youngest fellow citizens how interesting our work is.
Mini-microscope
Using our mini-microscope, the children could examine wirebonds and tiny chip packaging components. As always, they enjoyed taking a guess at how many chips were in the big glass jar – and were amazed to discover that the actual number was far higher than expected.
Chip packaging memory
We also introduced a new activity: a chip packaging memory game, which proved to be a huge success. Children loved challenging their parents while simultaneously learning all about different kinds of chip packages. Hopefully, this has planted a few STEM seeds.