CITC participates in CONNECT GLD consortium
CITC/TNO is proud to be part of the CONNECT GLD consortium, which aims to develop new production machinery and processes for the semiconductor industry. The ultimate goal is to produce the next generation of chips using less material and consuming less energy.
Photonic laser chip module
Within this consortium, we will collaborate with imec and OnePlanet Research Center on the development of a complete photonic laser chip module based on tunable, external cavity laser on a photonic integrated circuit, combined with innovative additive-printed packaging technology and control semiconductors.
Our focus is on the assembly and packaging of these chips, incorporating high-precision optical fiber alignment, robust electrical interconnects, and printed encapsulation that features small openings (≤ 100 µm) for light and sensor interactions. The goal is a functional demonstrator that is scalable for industrial production.
Screen printing
The innovation lies in an additive fan-out packaging method that uses screen printing to apply encapsulation materials with precision-engineered windows. This technique minimizes material waste, reduces costs, and makes the packaging suitable for densely packed sensor arrays - a capability that has not previously been achievable in high-end photonics.
Digital twin for sustainable packaging
Another project in which we will be collaborating is the development of a digital twin for sustainable packaging. Imec/One Planet Research Center is developing a hybrid AI model that combines physics-based simulations with data-driven predictions. This model will be trained on a dataset of packaging measurements collected by CITC/TNO.
We provide the packaging technology itself: an integrated photonic sensor housed in a state-of-the-art package, created using a sustainable additive printing method. The digital twin will be validated using new, previously unused test data to demonstrate its applicability in an industrial context. The result is a scalable solution that not only makes chip packaging more sustainable but is also applicable to a wide range of photonic and sensor chips with eco-friendly features.
More information
We look forward to contributing to the strengthening of the sustainable high-tech supply chain in the eastern Netherlands. For Dutch readers who would like to know more about this project: further information can be found on the High Tech NL website.
