CITC tests new pressure-less QFN samples
A new milestone within the POLARIS-NGF program: Neways Electronics has successfully manufactured the first QFN demonstrators utilizing a new pressure-less sintering material as die attach and has now delivered them to CITC/TNO for reliability testing.
Emerging technology
Pressure-less sintering is an emerging technology for semiconductor packaging and offers a promising alternative to conventional die attach materials for high-power, high-reliability industrial applications.
By eliminating the need for external pressure during assembly, this approach has the potential to simplify manufacturing while simultaneously delivering the thermal and mechanical performance required for the next generation of power electronics.
Validation
The demonstrators represent an important step in the validation of:
- Assembly feasibility in industrial manufacturing environments
- Reliability under demanding operating conditions
- Suitability for future high-power applications
Close collaboration
This achievement is the result of close collaboration between partners within the POLARIS ecosystem, where innovative materials research is transformed into tangible hardware ready for qualification and industrial evaluation.
The next phase will focus on comprehensive reliability testing to further assess the performance of this pressure-less sintering solution.