CITC/TNO partners with TANAKA
PRESS RELEASE - TANAKA Precious Metal Technologies Co., Ltd. has partnered with the Netherlands Organisation for Applied Scientific Research (TNO) to advance research and development in next-generation semiconductor packaging technologies through the Chip Integration Technology Center (CITC) in Nijmegen, the Netherlands.
CITC, part of TNO, specializes in advanced semiconductor back-end assembly, test and packaging design, connecting industry, academia, and research organizations.
Acceleration of development
Through this Japanese/European collaboration, TANAKA will combine its expertise in precious metal materials with CITC’s research capabilities and collaborative network. This accelerates the development and evaluation of next-generation packaging materials, including silver- and copper-based adhesive pastes for die/clip-bonding.
This three-year partnership commences in October 2026.