New CITC clip packaging platform
Proud to present our entirely in-house designed and developed clip packaging platform. CITC has worked on a platform for high-power clip packaging suitable for the assembly and testing of a wide range of adhesives and/or dies - and now it is ready for use!
Full flexibility
With this clip packaging platform, we can place various types of dies using different die attach materials and techniques, while maintaining full flexibility in optimizing the parameters of the process flow. Add the equipment in our lab to that, and a whole palette of process flows can be researched and optimized.