Practical week Semiconductor Packaging program
Last week, the practical week of the Semiconductor Packaging University Program took place. Three eager students, all industry professionals, worked in our labs and learned that dies can actually fly.
Introduction to packaging technologies
Course coordinator Ruben Pranger introduced them to several conventional packaging technologies, such as die attach, wire bonding, die shearing (see pictures on the right) and die encapsulation. After a week of hard work, the students’ efforts were rewarded with a well-deserved certificate and personalized keychain with chip.
Next edition
The next edition of the Semiconductor Packaging University Program will start in October 2026.