Registration 2026 Semiconductor Packaging Program now open
Ready to take a deep dive into the final step of packaging? As of today, it is possible to register for the CITC Semiconductor Packaging Program.
Program content
Theory sessions that focus on the design and manufacturing of semiconductor packages and the associated assembly, reliability and test techniques. All lecturers are industry experts from CITC, TNO and partner organizations.
Topics include
- Semiconductors and packaging
- Advanced applications
- Basic simulation and testing
- Quality, reliability and smart manufacturing
Dates
October 26-30, 2026 and November 2-3, 2026
Location
Noviotech Campus, building M, Nijmegen
Language
English
Interested?
Send an email to citc@tno.nl to receive a registration form.