Semiconductor Packaging program completed
And it’s a wrap! With the final presentation on quality and smart manufacturing, this year’s edition of the Semiconductor Packaging program has come to an end. Following a week filled with interactive presentations, the 28 participants have been fully immersed in the world of semiconductor packaging.
A world that includes basic assembly and packaging steps, advanced packaging technologies, power packaging, thermo-mechanical package simulation, integrated photonics and packaging for integrated antennas – to name just a few of the topics covered.
Certificate of completion
As always, the program concluded with a brief ceremony during which the participants received a well-deserved certificate of completion. The program’s initiator Joop Bruines, who coordinated the first five editions, was present to hand out the certificates.
For 10 participants, all from Universidad Tecnológica de Panamá, the program is not over yet. They will stay for an additional three days to engage in hands-on work in the CITC labs and visit various semiconductor companies at the Noviotech Campus.