CITC's new intern Subba Kedarnath Gupta Vemula will work on copper sinter pastes and investigate the role of additives.
30 young students from Weekendschool Nijmegen spent their Sunday afternoon learning more about chip packaging.
CITC is very pleased to welcome our new business development manager: Ruud de Wit.
The first edition of the Lifeport Semicon Event also marked the first time CITC presented itself as part of TNO.
For several CITC researchers, 2026 started with an extensive three-day training in confocal scanning acoustic microscopy.
CITC's Henry Martin travelled to Caceres, Spain, to attend the kick-off of the SPARK-e project, funded by the European Union.
In close collaboration with Holst Centre, CITC has developed a fan-out panel level packaging process. This is showcased in the first-ever FOPLP demo produced in the Netherlands.
Three eager students, all industry professionals, participated in the practical week of the Semiconductor Packaging Program.
CITC and Neways took an important step in the POLARIS NGF theme ‘Valorization – Technology Providers’.
(naar homepage)
