News

CITC's Henry Martin travelled to Caceres, Spain, to attend the kick-off of the SPARK-e project, funded by the European Union.

In close collaboration with Holst Centre, CITC has developed a fan-out panel level packaging process. This is showcased in the first-ever FOPLP demo produced in the Netherlands.

Three eager students, all industry professionals, participated in the practical week of the Semiconductor Packaging Program.

CITC and Neways took an important step in the POLARIS NGF theme ‘Valorization – Technology Providers’.

CITC will become part of TNO. This strategic move marks a significant step toward ensuring the long-term continuity and stability of CITC’s research and operations.

CITC received a couple of hundred children and their parents at the annual Nijmegen Technology Day.

The 6th edition of the CITC Semiconductor Packaging Program started this week. This year, Ruben Pranger is coordinating the program.

CITC's graduation student Alex Harper successfully presented and defended his work at the HAN University of Applied Sciences.

CITC participates in the QuLight Detection project in which we will be responsible for the electrical and optical integration of the SPAD sensor.