MiNaPAD 2026
On June 3 and 4, IMAPS Europe will organize MiNaPAD 2026 in Grenoble, France. CITC’s Ruud de Wit will present during the session on Heterogeneous Integration on June 4.
Latest developments
In his talk, Ruud will discuss several of our innovative assembly and test developments enabling the next generation of power and RF semiconductors such as:
- Long-term in package test performance and reliability data with Ag sintering on different PFQN set-ups
- A new Cu clip test vehicle to support power semiconductor manufacturers with their higher performance WBG and Pb-free initiatives
- Improving Ag sintering paste performance by certain additives, including correlation with micro-mechanical modeling techniques
- Alternative methods for higher heat dissipation like diamond heat spreaders and micro fluidic cooling
- A 100% additive and low-investment fan-out panel packaging concept with screen-printed through mold vias
More details
The session on heterogeneous integration is session P which will take place in the Auditorium. Ruud is the first speaker in this session, he will begin at 14:30 hrs.