Visit mayor and aldermen of Nijmegen
December 10, 2024 – Last week, the mayor and aldermen of Nijmegen visited Noviotech Campus. The Gemeente Nijmegen has been involved with CITC from the beginning, so we were delighted to welcome them.
Introduction to chip packaging
Francesca Chiappini introduced them to the world of chip packaging, CITC’s activities and ambition, and the societal challenges we are working on. It was great to see the continued involvement of local government – thank you for visiting!
November 4, 2024 – For the second year in a row, a group of Panamanian professors visited CITC. The professors took on the role of students during a week full of practical work in the CITC labs and visits to neighboring semiconductor (packaging) companies such as NXP Semiconductors and Neways Electronics International NV.
Expand practical knowledge and experience
They already followed the theoretical part of the Semiconductor Packaging University Program and now got the chance to expand their practical knowledge and experience. After many hours in the lab, they received a well-deserved certificate… and a pack of stroopwafels to take back to Panama.
IESTEC conference
Last week, our education consultant Joop Bruines traveled to Panama to speak at the IESTEC conference. He talked about challenges in semiconductor packaging and the CITC approach to address them. This visit was a nice prelude to the professors’ stay in the Netherlands.
October 28, 2024 – Many happy faces at CITC from students who graduated from this year’s edition of the Semiconductor Packaging University Program.
Theory only
The group of students who only followed the theoretical part received their certificates on October 15 and last Friday we awarded three certificates to the students who also followed the practical part. Congratulations to all! We hope that you can use the knowledge and experience you gained through the program in your daily work.
October 17, 2024 – We were pleased to receive visitors from Canada today. A delegation from several photonics companies visited the Noviotech Campus and stopped by at CITC.
Technology roadmap
Our program manager Integrated Photonics Packaging Sander Dorrestein gave them an update on our work in photonics and explained our Integrated Photonics Technology Roadmap. And of course, the visit was concluded with a tour of our lab facilities.
We would like to thank Fanny Bousquet from the Canadian embassy for organizing this visit.
October 2, 2024 – On September 25, we welcomed almost 90 people to our first CITC Innovation Day. Together with our partners Delft University of Technology and Holst Centre we updated the audience about the latest developments in chip packaging.
Keynote speakers
After two keynote speeches in the morning by Kouchi Zhang – ‘Heterogenous system integration and packaging – the key success factor of semiconductors in EU’ and Jaap Lombaers – ‘Chip integration – sexy again and in need of innovation’, we had 8 innovation pitches and a poster market in the afternoon.
Innovation pitches
For those interested in the topics of the innovation pitches:
- Edsger Smits (CITC) – ‘Package development for power: towards green and efficient electronics’
- Sander Dorrestein (CITC) – ‘How CITC semiconductorizes integrated photonics assembly and packaging’
- Gerwin Gelinck (Holst Centre/PITC) – ‘Introducing Photonic Integration Technology Centre’
- Henk van Zeijl (TU Delft) – ‘The Fabric of Chip Integration Technology’
- Francesca Chiappini (CITC) – ‘Technologies for Antenna-in-Package at CITC’
- Gari Arutinov (Holst Centre) – ‘Laser processes for microLED integration: Die Transfer | Bumping | Repair’
- Hylke B. Akkerman (Holst Centre) – ‘3D structural microelectronics by additive manufacturing’
- Mark Luke Farrugia, PMP (CITC) – ‘Competitive and Sustainable Advanced Packaging – CSAP’
It was a pleasure to have you all at the Noviotech Campus and we hope to see you again in two years!
September 26, 2024 – On September 24, mayor Bruls of Nijmegen and Marlou Peet-de Bruin officially opened our new accommodotion. In tribute to our late founder and first general manager, the new lab has been named the Barry Peet lab.
Innovative mentality
In his speech, chairman of the Supervisory Board Roel Fonville explained which character traits of Barry have led to the current culture and innovative mentality of CITC: “Barry was a people person with a genuine interest in people, what they do and what moves them, with curiosity about new technology. He did this in a playful way towards all involved, with creativity, curiosity, entrepreneurship and enthusiasm. How can this character and innovative style resonate better in the future than by giving this new beautiful accommodation his name?”
September 23, 2024 – What a fun day we had last Saturday! CITC made its debut at the Nijmegen Technology Day.
Our QFN competition where children could win a stroopwafel attracted many visitors who also wanted to know more about chip packaging.
Career in STEM
Together with our partner Sempro Technologies BV, we entertained a few hundred children and their parents. And now we hope that some of those kids will choose an education and career in STEM (and preferably chip research).
September 16, 2024 – What a morning it was at CITC! Now that we have moved to our new accommodation, we finally have room for the Boschman molding machine that we received in April.
Nerve-wracking
The molding machine had to be moved from the warehouse to its new home at CITC. It was nerve-wracking at times but the movers did a careful and very good job, the machine is now in place.
Last step in production
The molding machine offers us the possibility to carry out the last step in the production process in-house. This allows the packaging we develop to be fully tested for reliability and consistency.
September 5, 2024 – On Tuesday September 3, the fifth edition of the Semiconductor Packaging University Program started at the Noviotech Campus in Nijmegen. 29 people are taking part in the lustrum edition of the program. Over the next seven weeks, they will be introduced to the semiconductor industry and delve deep into the final step of chip manufacturing: chip packaging.
Mix of students and semicon staff
As in the four previous editions, the participants consist of a mix of students and professionals. Joop Bruines, education consultant at CITC and also working at HAN University of Applied Sciences (HAN), is happy with yet again a full classroom: “We have a good mix of people. In addition to industry participants from semiconductor companies such as ITEC, NXP, Sempro and iPronics, there are fifteen bachelor students from HAN and similar Dutch universities of applied sciences and from Rhein-Whaal Hochschule in Cleves. And there is one PhD student from University of Twente.”
Just like last year, there is a group of students from Panama who are following the program online. “Last year, four professors from Universidad Tecnológica de Panamá followed the theoretical program online and then came to the Netherlands for a week of practical training. Apparently, this was a success because four other professors are following the program this year. And they will also come over to the Netherlands later this year. I’m already looking forward to meeting them”.
Tailor-made program
CITC and HAN developed this program tailored to the specific needs of semiconductor companies. The program focuses on the design and manufacture of semiconductor packages and the associated assembly, reliability, and testing techniques. For the bachelor students the course is part of a full minor including a practical assignment which is carried out at either a semiconductor company or CITC.
Kick-off
Students listen to Henk van Zeijl (TU Delft) about semiconductors front end
In his introductory speech at the kick-off, Bruines emphasized the importance of chips in everyday life and the need for well-trained people in this field. Then he gave the floor to Henk van Zeijl from TU Delft for the first lecture of the program about the semiconductor front end.
Van Zeijl had brought along a large number of samples to support his story. The students were then able to delve into topics such as bandgap, Moore’s law, p-n junction, oxidation and disposition, and the mechanical and electrical properties of silicon.
Interested in following the next edition of this program? Check out the program information or contact us.
PRESS RELEASE | Nijmegen, the Netherlands | August 29, 2024
Chip Integration Technology Center (CITC) today announced the appointment of Toni Versluijs as the new chairman of its Supervisory Board. Versluijs will serve as the incoming chairman from September through December. Effective January 1, 2025, he will take over the responsibilities from chairman Roel Fonville who is retiring.
Versluijs has an extensive background of more than 25 years in the semiconductor industry, of which more than 15 years in general and executive management roles. Prior to this appointment, he worked for NXP, where he led the In-Vehicle Networking product line and was NXP Nijmegen site director and statutory director of NXP Netherlands. Most recently, he led the Business Group MOS at Nexperia, served as statutory director for Nexperia in the UK and was part of the company’s global executive leadership team.
He explains his choice for CITC: “I look forward to using my many years of experience in the semiconductor industry to contribute to the success of CITC in Nijmegen. Nijmegen is a location with a long heritage in semiconductor packages that have changed the world. CITC is a unique venture and has a unique position between private parties, the academic world and knowledge institutes.”
CITC is a smaller and different kind of organization than his previous employers, but Versluijs sees the potential: “CITC has attracted quite some talent in recent years, built partnerships and initiated new developments. In short: it has laid the foundation for growth, and it will flourish in the coming years. I am convinced that it has the potential to change the world of semiconductor packaging again”.
The current chairman of the CITC Supervisory Board, Roel Fonville, adds: “The Supervisory Board is very pleased to welcome Toni Versluijs to our midst. His personality and broad experience in the industry and in the Nijmegen region will help the Board to fulfill its role in securing the continued development of the organization.”
– ENDS –
About CITC
Chip Integration Technology Center (CITC) is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure, and education. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by local and regional governments.
www.citc.org
Contact
Christian Ketelaars, Communications Manager
E christian.ketelaars@citc.org
M +31 (0)6 48 15 42 92