Certificates for Semiconductor Packaging class of ‘22

October 17, 2022 – On October 10, the industry participants of the Semiconductor Packaging University Program 2022 received their certificates. Some of them will continue with the practical part of the program, together with the bachelor student participants.

International students

The third edition of the program started on August 29 in hybrid form. Most students attended the live sessions that were held at the Noviotech Campus, but due to the geographical distance, some followed the program via a live stream. Education consultant Joop Bruines, also responsible for coordinating the program, comments: “This year, we had participants not only from Germany, but also from Brazil and the U.S. It is great to see that our program is being followed more and more internationally.”

Mix of bachelor students and semicon staff

Like the previous edition, this year’s program was offered as a minor to bachelor students and industry professionals. Bruines: “We have a nice mix of people. In addition to participants from companies such as NXP and Nexperia, there are eight bachelor students from HAN and similar Dutch universities of applied sciences and from Rhein-Whaal Hochschule in Cleves.” He is also pleased that seven of this year’s participants are female. “That is a first for us. As everyone knows there are too few women in high-tech. We hope that with our program we can contribute to an increase of women in the semicon industry in the future.”

Tailor-made program

CITC and HAN University of Applied Sciences (HAN), developed this program tailored to the specific needs of semiconductor companies. The program focuses on the design and manufacturing of semiconductor packages and the associated assembly, reliability and test techniques. It includes a practical assignment that will be carried out on the premises of either a semiconductor company or CITC.

On October 10, the last lectures of the theoretical part of the program were given. Afterwards, the industry participants who subscribed for this part only received a certificate for attending the course. The bachelor students and some of the industry participants will continue the next part of the program which consists of practical assignments.

Fourth edition

The next edition of the Semiconductor Packaging University Program is scheduled for August/September 2023. Interested in following the next edition of this program? Please contact us for more information or to receive the registration form.