CITC and AntenneX join forces to characterize antenna-in-package applications at mmWave frequencies
PRESS RELEASE | Nijmegen, the Netherlands, January 20, 2022
On January 20, Chip Integration Technology Center (CITC) and AntenneX signed an agreement to formalize their collaboration. Both organizations are active in the RF domain, especially in 100 GHz+. Together, they address the characterization needs for next generation high-frequency packaging applications.
Due to the need for more and more bandwidth in wireless communication, the next generation communication standard (6G) is set to operate at frequencies around and above 100 GHz. From an electronic packaging point of view, this means a widespread adoption of antenna-in-package (AiP) type of devices where the antenna system is integrated into the device package.
This high degree of integration, combined with high operational frequencies, poses several challenges – not only for production, but also for the characterization of materials and performance of the AiPs. At these high frequencies, material characterization and over-the-air device measurement simultaneously become more important and challenging. Therefore, CITC and AntenneX work together to address the characterization needs for these kinds of packaging applications.
Novel packaging technologies and concepts
Francesca Chiappini, Program Manager RF Chip Packaging at CITC, is pleased with the collaboration: “Working with AntenneX is a welcome addition to our current ecosystem. They enable us to develop novel packaging technologies and concepts for higher frequencies. For measurements at lower frequencies, we are already working with the TNO Radar Technology department. With AntenneX, we can now cover the frequency spectrum beyond 100 GHz. They help us tackle issues such as dielectric material characterization and antenna measurements at frequencies of relevance for 6G and automotive radar.”
Sander Bronckers, one of the founders of AntenneX, adds: “Our services are complementary to CITC’s activities. When developing new equipment, tools and software, CITC helps us by providing extensive feedback. And they support us in defining requirements for measurements, analysis and characterization. Last, but not least, CITC has a large network. By working together, we can offer our tools and services to companies better and more easily.”
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Chip Integration Technology Center (CITC) is a non-proﬁt joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
AntenneX offers in-house antenna measurements and material characterization up to 140 GHz for applications such as wireless communications, car radar, 5G/6G, Internet-of-Things, medical imaging, remote sensing, and more. AntenneX supports your design of a wireless device by quantifying and interpreting the over-the-air performance via tools or services.