First-ever FOPLP demo in the Netherlands

November 6, 2025 – In close collaboration with Holst Centre, CITC has developed a fan-out panel level packaging (FOPLP) process. This is showcased in the first-ever FOPLP demo produced in the Netherlands.

Cost-effective platform

FOPLP is a cost-effective platform for high-performance small form factor packages. The CITC/Holst Centre panel measures 320 x 350 mm2. The technology forms the basis for further development and prototyping, as it serves as a building block for innnovative applications such as communication, radar and autonomous driving.

Test and collaborate

Now that the technology is available in the Netherlands, companies can test it and collaborate with us in Nijmegen and Eindhoven.