Semiconductor packaging News

Successful first edition of Semiconductor Packaging University Program

November 24, 2020 – Together with the HAN University of Applied Sciences, CITC developed a Semiconductor Packaging University Program. The program is tailored to the specific needs of the companies involved. Students and company employees learn about all relevant aspects in the field of packaging during the 5-month course. A practical assignment that will be carried out on the premises of either a semiconductor company or CITC is included in the program. The second edition of the course starts the first week of September 2021.

Successful first edition

  • In September 2020, at the start of the Program, RN7 and Omroep Gelderland published a (Dutch) news item about HAN & CITC’s new Semiconductor Packaging University program. Read the item and watch the video for the interview with Joop Bruines, Program Coordinator and Gwen Visser, student.
  • Read more about the first edition in this Microwave Journal article (English): ‘Kick-off to Unique Semiconductor Packaging Education Program’.
  • A while after the start of the program The Economic Board reported about it in this (Dutch) article with Barry Peet (General Manager CITC), Michiel van Soestbergen (researcher at NXP and involved as a teacher in the training) and Ruben van Knippenberg (participant from Nexperia).

Interested to join the second edition?
Details of the Semiconductor Packaging University Program – Edition 2021-2022

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