CITC joins Pact for Skills
April 11, 2025 – CITC is now a PactForSkills member, joining the European Commission and stakeholders engaged on upskilling and reskilling for a more resilient EU workforce.
Under the Pact, public and private organisations can join forces and take concrete action to support the green and digital transitions. You can find more information about the pact on the PackForSkills website.
April 10, 2025 – CITC is pleased to present its annual infographic. 2024 was a year full of firsts an special moments for CITC. We realized growth in office and lab space by moving to our new accommodation. We held our first Innovation Day. And last, but certainly not least: our program lines featured several innovations, all firsts in their field.
Innovation
Innovation is at the heart of CITC’s existence. In our four program lines we work on developments that contribute to solving societal challenges.
- Thermal high-performance management: high-power semiconductors are a key ingredient in our energy transistion. They will help to maintain and improve our modern and comfortable living standards. Their role in the fight against the climate crisis is crucial; they will help countries achieve their carbon neutrality targets. In 2024, CITC developed its first lead-free clip attached high-power device.
- RF and mmWave chip packaging: these chips enable the next generation of high-frequency applications. Future communication networks must be even faster, more reliable and more secure than current networks, and preferably made in Europe. Within the research and development of the next generation of communication networks, in particular 6G, CITC developed its first fan-out package in 2024.
- Integrated photonics packaging: photonic chips offer new and unique solutions where current conventional technologies reach their limits in terms of speed, capacity and accuracy. Integrated photonics packaging enables low-cost and high-volume photonics packages that can be used in applications such as data and telecom, AI, agrifood, healthcare and mobility. In 2024, CITC developed its first ultra-low loss interconnect.
- Advanced additive manufacturing packaging: our most promising and disruptive technology development enables an advanced ultra-low-cost and sustainable packaging platform – competitive sustainable advanced packaging (CSAP). CITC developed the first CSAP demo in 2024, which will be a key ingredient for creating an economically attractive proposition for investments in advanced packaging production in the Netherlands and the EU, while offering an environmentally friendly alternative.
Infrastructure
Our new location offers enough space for several newly acquired machines. Most notable were the Boschman molding machine and the Finetech Femto 2. The molding machine offers us the possibility to carry out the last step in the production process in-house. This allows the packaging solution we develop to be fully tested for reliability and consistency. The Finetech advanced sub-micron bonder is a versatile machine with a very well-defined process control. This makes it suitable for both classic and advanced packaging applications.
On September 25, mayor Bruls of Nijmegen officially opened the new CITC accommodation. In tribute to our late founder and first general manager, the new lab has been named the Barry Peet lab.
Education
CITC works with educational institutions and industry to ensure that talent is given sufficient opportunities to develop the skills that are in demand in the industry. Talent is not age-related and that is why we focus on all levels of education. We help to create enthusiasm for STEM by giving children the opportunity to try things out for themselves during events.
We offer older students opportunities to participate in guest lectures, practical assignments or internships. And finally, we offer formal education to bachelor students and industry professionals in our accredited Semiconductor Packaging University Program.
Jibran Ahmed Khan from Hochschule Rhein-Waal followed the CITC Semiconductor Packaging minor and then did his bachelor thesis work at CITC: “This email is to inform you that I graduated with a very good grade for my final thesis and colloquium. I am very thankful to CITC for offering such a wonderful opportunity”.
In conclusion
Since our foundation over 5 years ago, CITC has taken significant steps in realizing its ambition to become a leading partner in semiconductor and photonics packaging. In the coming years, we will continue our research work to reduce the cost of advanced packaging and thus make a major contribution to the return of the packaging industry to the EU.
We will continue our efforts to put CITC and Nijmegen on the European chip technology innovation map. By becoming a strong research institute with education and training as part of the offer, we will contribute to making the region more attractive to major investors.
Downloads
CITC 2024 results infographic (EN)
CITC 2024 results infographic (NL)
April 2, 2025 – Yesterday, 109 students from Nijmegen based secondary school Mondial College toured the Noviotech Campus. The students visited CITC, NXP Semiconductors and Sempro Technologies. Within their school subject Research & Design, they have to create a chip tech exhibit for the Nijmegen Technology Day.
How to become a scientist
CITC offered the students a short guest lecture about chip packaging and career information on how to become a scientist. Afterwards, the childred toured the CITC labs and worked on several small assignments related to chip packaging.
We really enjoyed hosting those 14/15-year olds and we hope that some of them will pursue an education and career in STEM.
March 28, 2025 – Last Friday, our colleague Henry Antony Martin gave a guest lecture at Delft University of Technology. Within the course Microelectronics Reliability he talked to 15 students about reliability challenges and assessment methods in electronics packaging.
Next generation of researchers
Henry’s guest lecture is part of our many educational activities. CITC strongly supports the education of the new generation of semiconductor researchers.
March 25, 2025 – Hora est! Yesterday, our colleague Henry Antony Martin successfully presented and defended his thesis ‘Prognostics and Thermal Management of Power Electronic Packages’ at Delft University of Technology.
First CITC PhD
He was awarded the degree of doctor, making him the first CITC PhD candidate to achieve this.
He received his degree from his two promotors: professor dr. Kouchi Zhang and professor dr. ir. Willem van Driel.
We are very proud of him and hope he is the first of many to follow.
March 21, 2025 – It was great fun to participate in the regio Nijmegen On Stage Career Festival last Tuesday. About 1,000 students got the chance to explore future professions and CITC was there to promote the job of researcher.
Promotion of STEM
We fully support the central theme of the festival: ‘You may become anything… except unhappy – promise?’ and hope that the 13/14-year olds present will choose a career in STEM.
February 10, 2025 – On February 7, CITC had a visit from Member of Parliament Joris Thijssen. After a visit to Nexperia and ITEC, CITC was part of his working visit to the semiconductor sector in Lifeport Region Arnhem-Nijmegen.
Introduction to the world of chip packaging
Francesca Chiappini introduced him to the world of chip packaging and explained how innovation in chip packaging contributes to more efficient, sustainable and smarter chips. He also learned about our education activities and the need for trained semiconductor staff in this region, the rest of the Netherlands, and Europe.
A special thanks to The Economic Board Regio Arnhem Nijmegen for organizing this visit!
January 29, 2025 – On January 28, we welcomed a delegation from the Provincie Gelderland. The delegation was touring the Noviotech Campus and also visited our office and labs.
Groundbreaking chip packaging research
On behalf of CITC, Francesca Chiappini introduced them to the world of groundbreaking chip packaging research and its importance for Nijmegen and Gelderland. We enjoyed sharing our story and hope the feeling is mutual – thank you for visiting!
January 28, 2025 – What better way to spend your Sunday than learning about chip packaging? Nearly 30 students from IMC Weekendschool visited CITC and toured the labs under guidance of our colleagues Henry Antony Martin and Noud Schoenmakers.
Budding scientists
They also worked on coding and decoding pixel drawings and continued their microbit programming project. There were certainly some budding scientists in this group – we were impressed with their knowledge and happy to host them!
January 25, 2025 – CITC celebrates the International Day of Education together with the students who finished their Semiconductor Packaging minor this week. Congratulations to all of you – your hard work on the CITC, NXP Semiconductors and ASMPT ALSI assignments has paid off. Best of luck with the rest of your education and perhaps we will see you again, as an intern or colleague.
Minor student becomes intern
One of the students, Alex Harper, soon returned to CITC as an intern. In the coming months, he will be working on slit nozzle dispensing. His assignment focuses on the design of the nozzle and process research. For those who like to have a little background on this topic: current slit nozzles that are commercially available are relatively expensive and have a long lead time of 2-3 months. CITC worked on an alternative design (patent pending) which differs from other nozzles in that the design is flexible.
Iterations in both dispense volume and shapes are easy to make. Production is done with 3D printing, which is cheap and makes the nozzles disposable. Alex will work on improvements to the current design and define process parameters – one cannot exist without the other.